LSISAS1068 LSI, LSISAS1068 Datasheet - Page 112

• Manufacturer Part Number: LSISAS1068
• Manufacturer: LSI

Specifications of LSISAS1068

• Lead Free Status / RoHS Status: Not Compliant

Table 5.1
1.
Table 5.2
1.
2.
3.
4.
5-2
V
V
ESD
Symbol Parameter
Symbol
I
V
DD-Core
V
I
DD-Core
DD-Core
DD-I/O
T
DD-IO
DD-IO
Stresses beyond those listed above can damage the device. These are stress ratings only;
functional operation of the device at or beyond these values is not implied.
Conditions that exceed the operating limits can cause the device to function incorrectly.
Core and analog supply only.
These numbers are specified for the design of the I/O power network. Not all of the I
to the LSISAS1068 dissipates on-chip.
LSI Logic recommends using a heat sink for the LSISAS1068. See the LSISAS1068 Design Con-
siderations SEN for more detail.
I
T
STG
T
LP
JA
A
j
HBM
Core and Analog Supply
Voltage
I/O Supply Voltage
Core and Analog Supply
Current (dynamic)
I/O Supply Current
(dynamic)
Junction Temperature
Operating Free Air
Thermal Resistance
(junction to ambient air)
Parameter
Storage Temperature
Supply Voltage
I/O Supply Voltage
Latch-up Current
Electrostatic Discharge -
Human Body Model (HBM)
Absolute Maximum Stress Ratings
Operating Conditions
3
Specifications
Copyright © 2004, 2005 by LSI Logic Corporation. All rights reserved.
2
4
1
1.14
2.97
Min
–
–
–
0
–
Min
-0.3
-0.3
-65
150
–
Nominal
1.20
1.55
15.4
3.3
0.2
–
–
1
2000
Max
3.96
150
2.0
–
Max
1.26
3.63
1.85
115
1.0
70
–
Unit
mA
Unit
V
V
V
C/W
C
V
V
A
A
C
C
0 Linear Feet/Minute
Test Conditions
Test Conditions
JESD-A114-B
EIA/JESD78
DD-I/O
–
–
–
–
–
–
–
–
–
supplied