PNX1302EH NXP Semiconductors, PNX1302EH Datasheet - Page 195
PNX1302EH
Manufacturer Part Number
PNX1302EH
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1302EH.pdf
(548 pages)
Specifications of PNX1302EH
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Philips Semiconductors
12.17.1.3 128-Mbit Devices
128-Mbit SDRAMs organized in x16 are partially sup-
ported. The support is provided for a 32-MB memory sys-
tem. It can only contain one rank (i.e. it cannot be extend-
Figure 12-9. Schematic of a 32-MB memory system consisting of two 4×2M×16 SDRAM chips (one rank)
MM_CLK[0]
MM_CLK[1]
CLK
Control
CLK
Control
Address[11:0]
Address[11:0]
BA[1:0]
BA[1:0]
PNX1300
4×2M×16
4×2M×16
SDRAM
SDRAM
ed using the other MM_CS# pins). There are two
possible connection schemes.
Figure 12-9
MM_CONFIG.SIZE must be set to 6 (i.e. 16 MB rank
size,
PRELIMINARY SPECIFICATION
DQM[1:0]
DQM[1:0]
DQ[15:0]
DQ[15:0]
CS#
CS#
Section
GND
GND
is backward compatible with TM-1300.
12.6.1).
MM_DQ[31:16]
MM_DQM[3:2]
MM_DQ[15:0]
MM_DQM[1:0]
SDRAM Memory System
12-13
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