PNX1302EH NXP Semiconductors, PNX1302EH Datasheet - Page 36

• Manufacturer Part Number: PNX1302EH
• Manufacturer: NXP Semiconductors

Specifications of PNX1302EH

• Lead Free Status / RoHS Status: Not Compliant

PNX1300/01/02/11 Data Book
1.7
1.8
1.8.1
To order 143-MHz/2.5V product, part number is ‘PNX1300EH’, 12 nc product code 9352 7097 6557.
To order 180-MHz/2.5V product, part number is ‘PNX1301EH’, 12 nc product code 9352 7097 9557.
To order 200-MHz/2.5V product, part number is ‘PNX1302EH’, 12 nc product code 9352 7098 2557.
To order 166-MHz/2.2V product, part number is ‘PNX1311EH’, 12 nc product code 9352 7098 5557.
1-10
HBGA292: plastic, heatsink ball grid array package; 292 balls; body 27 x 27 x 1.75 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
PACKAGE
ORDERING INFORMATION
max.
2.51
Lead Parts: Last time buy for these parts is September 30, 2005:
A
ball A1
index area
0.70
0.50
A 1
W
k
G
U
R
N
E
C
A
L
J
M
Y
V
P
K
H
D
B
T
F
1.83
1.63
A 2
PRELIMINARY SPECIFICATION
1
2
k
3
0.90
0.60
4
b
e
5
6
27.2
26.8
7
D
8
9
10
24.1
23.9
D 1
e 1
D
D 1
11
12
b
13
27.2
26.8
14
E
0
15
∅
16
w
24.1
23.9
17
E 1
M
18
19
20
1.27
e
scale
10
e
∅ j
24.13
B
v
e 1
M
e 1
E 1
B
v
21.0
15.4
∅ j
A
E
M
A
20 mm
4.2
3.8
k
A
A 2
A
0.2
y 1 C
v
1
0.2
w
0.15
Philips Semiconductors
y
detail X
C
X
0.25
y
y 1
End of Life 09/30/08.
End of Life 09/30/08
End of Life 09/30/08
End of Life 09/30/08
SOT553-1
.
.
.