PIC16F877A-I/PT Microchip Technology Inc., PIC16F877A-I/PT Datasheet - Page 154

• Manufacturer Part Number: PIC16F877A-I/PT
• Description: 44 PIN, 7 KB FLASH, 368 RAM, 33 I/O
• Manufacturer: Microchip Technology Inc.

Specifications of PIC16F877A-I/PT

• A/d Inputs: 8-Channel, 10-Bit
• Comparators: 2
• Cpu Speed: 5 MIPS
• Eeprom Memory: 256 Bytes
• Input Output: 33
• Interface: I2C/SPI/USART
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 44-pin TQFP
• Programmable Memory: 14K Bytes
• Ram Size: 368 Bytes
• Speed: 20 MHz
• Timers: 2-8-bit, 1-16-bit
• Voltage, Range: 2-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PIC16F87X
15.1
DS30292C-page 152
PIC16LF873/874/876/877-04
PIC16F873/874/876/877-04
PIC16F873/874/876/877-20
D001
D001
D001A
D002
D003
D004
D005
Legend: Rows with standard voltage device data only are shaded for improved readability.
Note 1: This is the limit to which V
Param
(Commercial, Industrial)
(Commercial, Industrial)
No.
†
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
4: For RC osc configuration, current through R
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from charac-
6: The
7: When BOR is enabled, the device will operate correctly until the V
DC Characteristics:
Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance
only, and are not tested.
loading, switching rate, oscillator type, internal code execution pattern and temperature also have an impact
on the current consumption.
The test conditions for all I
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
mated by the formula Ir = V
terization and is for design guidance only. This is not tested.
added to the base I
Symbol
V
S
V
V
V
POR
VDD
BOR
DD
DR
current is the additional current consumed when this peripheral is enabled. This current should be
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V
MCLR = V
Supply Voltage
RAM Data Retention
Voltage
V
ensure internal Power-on
Reset signal
V
internal Power-on Reset
signal
Brown-out Reset
Voltage
DD
DD
Start Voltage to
Rise Rate to ensure
Characteristic/
(1)
DD
Device
DD
or I
; WDT enabled/disabled as specified.
PD
DD
DD
16LF87X
DD
PIC16F873/874/876/877-04 (Commercial, Industrial)
PIC16F873/874/876/877-20 (Commercial, Industrial)
PIC16LF873/874/876/877-04 (Commercial, Industrial)
16F87X
measurement.
can be lowered without losing RAM data.
measurements in active operation mode are:
/2R
EXT
(mA) with R
Standard Operating Conditions (unless otherwise stated)
Standard Operating Conditions (unless otherwise stated)
V
Operating temperature
Operating temperature
0.05
Min
2.0
4.0
4.5
3.7
BOR
—
—
EXT
Typ†
is not included. The current through the resistor can be esti-
V
1.5
4.0
—
—
—
SS
EXT
in kOhm.
Max
4.35
5.5
5.5
5.5
5.5
—
—
—
Units
V/ms See section on Power-on Reset for
-40°C
-40°C
V
V
V
V
V
V
V
BOR
0°C
0°C
LP, XT, RC osc configuration
(DC to 4 MHz)
LP, XT, RC osc configuration
HS osc configuration
BOR enabled, F
See section on Power-on Reset for
details
details
BODEN bit in configuration word
enabled
voltage trip point is reached.
T
T
T
T
A
A
A
A
2001 Microchip Technology Inc.
+85°C for industrial
+85°C for industrial
+70°C for commercial
+70°C for commercial
Conditions
MAX
DD
= 14 MHz
DD
;
and V
SS
(7)
.