TMPM370FYDFG Toshiba, TMPM370FYDFG Datasheet - Page 490

• Manufacturer Part Number: TMPM370FYDFG
• Description: Microcontrollers (MCU) MCU w/ ARM Cortex-M3 256K FLASH, 10K RAM
• Manufacturer: Toshiba

Specifications of TMPM370FYDFG

• Processor Series: TX03
• Core: ARM Cortex M3
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Product Summaries: Summary
• Lead Free: Yes
• Rohs Compatible Product(s): Available
• Rom (kbytes): 256K
• Rom Type: Flash
• Ram (kbytes): 10K
• Number Of Pins: 100
• Package: QFP(14x20)
• Vcc: 5V
• Cpu Mhz: 80
• Ssp (ch) Spi: -
• I2c/sio (ch): -
• Uart/sio (ch): 4
• Usb: -
• Can: -
• Ethernet: -
• External Bus Interface: N
• Cs/wait Controller (ch): -
• Dma Controller: -
• 10-bit Da Converter: -
• 10-bit Ad Converter: -
• 12-bit Ad Converter: 27
• 16-bit Timer / Counter: 8
• Motor / Igbt Control: Vector Engine
• Real Time Clock: -
• Watchdog Timer: Y
• Osc Freq Detect: Y
• Clock Gear: Y
• Low-power Hold Function: -
• Remote Control Interface: -
• Hardware Cec Controller: -
• Comparators: 4
• Low-voltage Detector: Y
• Etm Hardware Trace: 2-bit
• Lead Free Status / Rohs Status: Details

24.9 Oscillation Circuit
24.10 Handling Precaution
Solderability
Solderability
parameter
Note1: The load value of the oscillator is the sum of loads (C1 and C2) and the floating load of the
Note2: Do not be driven X1/X2 by external driver.
Test
selecting external parts.
The TMPM370 has been evaluated by the oscillator vender below. Use this information when
The TMPM370 recommends the high-frequency oscillator by Murata Manufacturing Co., Ltd.
Please refer to the following URL for details.
http://www.murata.co.jp
(1) Connection example
(2) Recommended ceramic oscillator
actual assembled board. There is a possibility of operating error when using C1 and C2
values in the table below. When designing the board, design the minimum length pattern
around the oscillator. We also recommend that oscillator evaluation be carried out using
the actual board.
Use of Sn-37Pb solder Bath
Solder bath temperature = 230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Use of Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature = 245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Fig 24-4 High-frequency oscillation connection
Test condition
C1
X1
TMPM370 24-9
C2
X2
Rd
Pass:
solderability rate until forming ≧ 95%
Electrical Characteristics
Note
TMPM370