PCI9030-AA60BI PLX Technology, PCI9030-AA60BI Datasheet - Page 178

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PCI9030-AA60BI

Manufacturer Part Number
PCI9030-AA60BI
Description
Peripheral Drivers & Components (PCIs) 32-bit 33MHz PCI v.2.2-compliant
Manufacturer
PLX Technology
Datasheets

Specifications of PCI9030-AA60BI

Package / Case
FPBGA-180
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Operating Supply Voltage
3.3 V
Lead Free Status / Rohs Status
No RoHS Version Available

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Section 13
Physical Specifications
Table 13-2. Symbol Definitions—PQFP Package
13-2
Symbol
Fiducial
A
A
E
D
A
e
b
1
2
Pad Length
Package width
Package length
Mounting height
Standoff height
Package height
Linear lead pitch
Lead width
1.524 mm
Term
Figure 13-2. 176-Pin PQFP PCB Layout Suggested Land Pattern
0.3048 mm
Pad Width
Width of package
Length of package
Height from the ground plane
to the top of the package
Height from the ground plane
to the bottom edge of the
package (PGA)
Height of the package
(excluding warp of package)
Theoretical lead pitch
Lead width or diameter
(excluding surface plating)
Definition
Pad Pitch = 0.500 mm
A = 27.178 mm
Keepout Area
Solder Mask
Symbol
L, L
R, R
2, 3
H
H
C
1
E
D
, L
1
2
Fiducial
Lead thickness
Lead angle
Chamfer angle
Lead length or length
of flat lead section
Overall width
Overall length
Reverse bending
© 2002 PLX Technology, Inc. All rights reserved.
Term
PCI 9030 Data Book Version 1.4
Thickness of lead (excluding
surface plating)
Angle of leads versus seating
plane
Package chamfer angle
Lead length or length of
flat lead section
Width including leads
Length
Reverse bending type
B = 27.178 mm
Definition
Metal Pad
1.016 mm
2.54 mm
176-Pin PQFP

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