PCI9030-AA60BI PLX Technology, PCI9030-AA60BI Datasheet - Page 181

• Manufacturer Part Number: PCI9030-AA60BI
• Description: Peripheral Drivers & Components (PCIs) 32-bit 33MHz PCI v.2.2-compliant
• Manufacturer: PLX Technology

Specifications of PCI9030-AA60BI

• Package / Case: FPBGA-180
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 3.3 V
• Lead Free Status / Rohs Status: No RoHS Version Available

180-Pin µBGA
Table 13-4. Symbol Definitions—µBGA Package
PCI 9030 Data Book Version 1.4
© 2002 PLX Technology, Inc. All rights reserved.
Symbol
D
E
A
Package width
Package length
Height
Term
Figure 13-5. 180-Pin µBGA PCB Layout Suggested Land Pattern
Creating a solder mask
clearance using the Via pad
is not recommended.
Detail of
Each Pad
and Breakout
Via Pad Diameter
13 mm
0.508 mm
Width of package
Length of package
Height from the ground plane
to the top of the package
Definition
0.8 mm
Pin A1 Designator
(Silkscreen)
Copper Crop Lines (Allows for
visual inspection of whether the
µBGA is centered on the pads)
0.15 mm FHS
Topside View
Pin A1
Symbol
13 mm
A
e
b
1
Solder Mask Keepout
0.05–0.07 mm
Ball height
Ball pitch
Ball width
Solder Mask
0.35 mm
Diameter Land
Term
0.25 mm
1.27 mm
Height from the ground plane
to the bottom edge of the
package (PGA)
Theoretical lead pitch
Ball width or diameter
(excluding surface plating)
Physical Specifications
Definition
Section 13
13-5