LPC1857_53 NXP Semiconductors, LPC1857_53 Datasheet - Page 120

• Manufacturer Part Number: LPC1857_53
• Description: The LPC1857/53 are ARM Cortex-M3 based microcontrollers for embedded applications
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Fig 36. Package outline of the TFBGA180 package
LPC1857_53
Objective data sheet
TFBGA180: thin fine-pitch ball grid array package; 180 balls
DIMENSIONS (mm are the original dimensions)
mm
UNIT
SOT570-3
VERSION
OUTLINE
max
nom
min
ball A1
index area
ball A1
index area
1.20
1.06
0.95
A
M
K
H
D
B
P
F
0.40
0.35
0.30
N
G
C
A
L
J
E
A
1
IEC
1
0.80
0.71
0.65
2
A
2
3
4
0.50
0.45
0.40
e
5
b
6
7
12.1
12.0
11.9
e
D
JEDEC
D
1
8
All information provided in this document is subject to legal disclaimers.
9
1/2 e
10
12.1
12.0
11.9
REFERENCES
E
0
11
Rev. 1 — 14 December 2011
12
b
0.8
13
e
14
10.4
JEITA
e
1
1/2 e
scale
B
e
5
∅ v
∅ w
10.4
e
e
A
E
2
2
M
M
C
C
0.15
v
A
B
A
10 mm
0.05
w
A
32-bit ARM Cortex-M3 microcontroller
2
0.12
A
y
1
y
1
C
0.1
y
detail X
1
PROJECTION
EUROPEAN
LPC1857/53
C
X
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
08-07-09
10-04-15
SOT570-3
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