LPC1857_53 NXP Semiconductors, LPC1857_53 Datasheet - Page 124
LPC1857_53
Manufacturer Part Number
LPC1857_53
Description
The LPC1857/53 are ARM Cortex-M3 based microcontrollers for embedded applications
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1853FBD208.pdf
(131 pages)
- Current page: 124 of 131
- Download datasheet (2Mb)
NXP Semiconductors
LPC1857_53
Objective data sheet
Fig 40. Reflow soldering for the LQFP208 package
Footprint information for reflow soldering of LQFP208 package
DIMENSIONS in mm
0.500
P1
0.560
P2
31.300 31.300 28.300 28.300
Hy
Ax
solder land
occupied area
Gy
Ay
C
Bx
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
Rev. 1 — 14 December 2011
0.280
Generic footprint pattern
D1
0.400 28.500 28.500 31.550 31.550
P1
D2
Hx
Gx
Bx
Ax
Gx
(0.125)
Gy
32-bit ARM Cortex-M3 microcontroller
Hx
D1
Hy
LPC1857/53
By
© NXP B.V. 2011. All rights reserved.
Ay
sot459-1_fr
SOT459-1
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