LPC1857_53 NXP Semiconductors, LPC1857_53 Datasheet - Page 123
LPC1857_53
Manufacturer Part Number
LPC1857_53
Description
The LPC1857/53 are ARM Cortex-M3 based microcontrollers for embedded applications
Manufacturer
NXP Semiconductors
Datasheet
1.LPC1853FBD208.pdf
(131 pages)
NXP Semiconductors
LPC1857_53
Objective data sheet
Fig 39. Reflow soldering for the TFBGA180 package
Footprint information for reflow soldering of TFBGA180 package
DIMENSIONS in mm
0.80
P
0.400
SL
0.400
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.550
SR
P
12.575 12.575
Hx
Refer to the package outline drawing for actual layout
Hy
All information provided in this document is subject to legal disclaimers.
P
Rev. 1 — 14 December 2011
Generic footprint pattern
Hx
32-bit ARM Cortex-M3 microcontroller
detail X
SR
SL
SP
see detail X
LPC1857/53
© NXP B.V. 2011. All rights reserved.
sot570-3_fr
SOT570-3
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