XC2VP20-6FF1152C Xilinx, Inc., XC2VP20-6FF1152C Datasheet - Page 202
![no-image](/images/no-image-200.jpg)
XC2VP20-6FF1152C
Manufacturer Part Number
XC2VP20-6FF1152C
Description
Pro Platform FPGA
Manufacturer
Xilinx, Inc.
Datasheet
1.XC2VP20-6FF1152C.pdf
(268 pages)
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Part Number:
XC2VP20-6FF1152C
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Virtex-II Pro™ Platform FPGAs: Pinout Information
FF1517 Flip-Chip Fine-Pitch BGA Package
As shown in
Following this table are the
Table 11: FF1517 — XC2VP50
Module 4 of 4
202
Table
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
11, the XC2VP50 Virtex-II Pro device is available in the FF1517 flip-chip fine-pitch BGA package.
FF1517 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm
IO_L03P_0/VREF_0
IO_L09P_0/VREF_0
IO_L27P_0/VREF_0
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
www.xilinx.com
IO_L05_0/No_Pair
1-800-255-7778
Pin Description
IO_L02N_0
IO_L02P_0
IO_L03N_0
IO_L06N_0
IO_L06P_0
IO_L07N_0
IO_L07P_0
IO_L08N_0
IO_L08P_0
IO_L09N_0
IO_L19N_0
IO_L19P_0
IO_L20N_0
IO_L20P_0
IO_L21N_0
IO_L21P_0
IO_L25N_0
IO_L25P_0
IO_L26N_0
IO_L26P_0
IO_L27N_0
IO_L37N_0
IO_L37P_0
IO_L38N_0
IO_L38P_0
IO_L39N_0
IO_L39P_0
IO_L43N_0
IO_L43P_0
DS083-4 (v1.0) January 31, 2002
Advance Product Specification
pitch).
Pin Number
G29
G31
G30
G28
G27
F32
E32
K29
K28
K27
H30
H29
F31
D32
C32
H28
F30
E31
D31
H27
F29
E29
E30
D30
K26
F28
D29
C29
K25
F27
J29
J28
J27
J26
J25
R
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