mt47h128m16hg-3-it Micron Semiconductor Products, mt47h128m16hg-3-it Datasheet - Page 112

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mt47h128m16hg-3-it

Manufacturer Part Number
mt47h128m16hg-3-it
Description
2gb X4, X8, X16 Ddr2 Sdram
Manufacturer
Micron Semiconductor Products
Datasheet
FBGA Package Capacitance
Table 45:
PDF: 09005aef824f87b6/Source: 09005aef824f1182
2gb_ddr2.fm - Rev. A 9/06 EN
Parameter
Input capacitance: CK, CK#
Input capacitance: BA2–BA0, A0–A14 (A0–A13 on
x16), CS#, RAS#, CAS#, WE#, CKE, ODT
Input/Output capacitance: DQs, DQS, DM, NF
Input Capacitance
Notes:
1. This parameter is sampled. V
2. Reduce MAX limit by 0.25pF for -3/-3E speed devices.
T
balls, reflecting the fact that they are matched in loading.
C
= 25°C, V
OUT
(
DC
) = V
DD
Q/2, V
Symbol
112
CCK
CIO
DD
CI
OUT
= +1.8V ±0.1V, V
(peak-to-peak) = 0.1V. DM input is grouped with I/O
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Min
1.0
1.0
2.5
2Gb: x4, x8, x16 DDR2 SDRAM
DD
Q = +1.8V ±0.1V, V
FBGA Package Capacitance
Max
2.0
2.0
4.0
©2006 Micron Technology, Inc. All rights reserved.
Units
REF
pF
pF
pF
= V
SS
, f = 100 MHz,
Notes
1, 2
1
1

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