mt47h128m16hg-3-it Micron Semiconductor Products, mt47h128m16hg-3-it Datasheet - Page 7

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mt47h128m16hg-3-it

Manufacturer Part Number
mt47h128m16hg-3-it
Description
2gb X4, X8, X16 Ddr2 Sdram
Manufacturer
Micron Semiconductor Products
Datasheet
Part Numbers
Figure 1:
FBGA Part Marking Decoder
General Description
PDF: 09005aef824f87b6/Source: 09005aef824f1182
2gb_ddr2.fm - Rev. A 9/06 EN
2Gb DDR2 Part Numbers
Note:
Due to space limitations, FBGA-packaged components have an abbreviated part
marking that is different from the part number. Micron’s FBGA Part Marking Decoder is
available at
The 2Gb DDR2 SDRAM is a high-speed CMOS, dynamic random access memory
containing 2,147,483,648 bits. It is internally configured as an 8-bank DRAM. The func-
tional block diagrams of the all device configurations are shown in “Functional Descrip-
tion” on page 14. Ball assignments and signal descriptions are shown in “Ball
Assignment and Description” on page 9.
The 2Gb DDR2 SDRAM uses a double data rate architecture to achieve high-speed oper-
ation. The double data rate architecture is essentially a 4n-prefetch architecture, with an
interface designed to transfer two data words per clock cycle at the I/O balls. A single
read or write access for the 2Gb DDR2 SDRAM effectively consists of a single 4n-bit-
wide, one-clock-cycle data transfer at the internal DRAM core and four corresponding
n-bit-wide, one-half-clock-cycle data transfers at the I/O balls.
A bidirectional data strobe (DQS, DQS#) is transmitted externally, along with data, for
use in data capture at the receiver. DQS is a strobe transmitted by the DDR2 SDRAM
during READs and by the memory controller during WRITEs. DQS is edge-aligned with
data for READs and center-aligned with data for WRITEs. The x16 offering has two data
strobes, one for the lower byte (LDQS, LDQS#) and one for the upper byte (UDQS,
UDQS#).
Not all speeds and configurations are available. Contact Micron sales for current revision.
Configuration
MT47H
128 Meg x 16
512 Meg x 4
256 Meg x 8
Example Part Number: MT 4 7H 25 6 M 8H G-3 7 E :A
Package
84-Ball 11.5mm x 14mm FBGA
60-Ball 11.5mm x 14mm FBGA
www.micron.com/decoder.
128M16
512M4
256M8
Configuration
7
Package
HG
HG
Micron Technology, Inc., reserves the right to change products or specifications without notice.
-
Speed
-37E
-5E
-3E
-3
2Gb: x4, x8, x16 DDR2 SDRAM
L
IT
Low-Power
Industrial Temperature
t CK = 5ns, CL = 3
t CK = 3.75ns, CL = 4
t CK = 3ns, CL = 5
t CK = 3ns, CL = 4
Speed Grade
:A
Revision
:
Revision
©2006 Micron Technology, Inc. All rights reserved.
Part Numbers

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