gwixp425bdt Intel Corporation, gwixp425bdt Datasheet - Page 50

• Manufacturer Part Number: gwixp425bdt
• Description: Intel Xp42x Product Line Of Network Processors And Ixc1100 Control Plane Processor
• Manufacturer: Intel Corporation

Intel
4.0
4.1
Figure 7.
March 2005
50
1.
2.
3.
45º Chamfer
®
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
4 Places
22.00 REF
All measurements are in millimeters (mm).
The size of the land pad at the interposer side (1) is 0.81 mm.
The size of the solder resist at the interposer side (2) is 0.66 mm.
Package and Pinout Information
The Intel
have a 492-ball, plastic ball grid array (PBGA) package for commercial-temperature applications
and a pin-for-pin, compatible 492-ball, plastic ball grid array with a drop-in heat spreader (H) for
extended-temperature applications.
Package Description
492-Pin Lead PBGA Package
0.127 A
TOP VIEW
35.00 ± 0.20
30.00 ± 0.25
22.00 REF
Pin 1 ID
®
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
0.61 ± 0.06
2.38 ± 0.21
Document Number: 252479, Revision: 005
-A-
30.00 ± 0.25
0.60 ± 0.10
1.17 ± 0.05
35.00 ± 0.20
-B-
SIDE VIEW
ø
0.30
30º
S
3 Places
2
3
Seating Plane
C
1.63 REF
A
ø1.0
S
ø
B S
1.27
0.90
0.60
0.20
0.15
C
26
+
+
+
25
-C-
24
23
22
1.63 REF
21
20
19
18
17
16
15
14
(1)
13
12
1.27
11
10
9
8
7
6
+ +
5
4
3
2
1
AA
AB
AC
AD
AE
AF
B
C
D
E
F
G
H
K
L
M
N
P
R
U
W
A
J
T
V
Y
Datasheet
B1268-03
Pin #1
Corner
(2)