MAX5980GTJ+T Maxim Integrated, MAX5980GTJ+T Datasheet - Page 2

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MAX5980GTJ+T

Manufacturer Part Number
MAX5980GTJ+T
Description
Power Switch ICs - POE / LAN 0-16V Hot-Swap Controller
Manufacturer
Maxim Integrated
Datasheet

Specifications of MAX5980GTJ+T

Rohs
yes
Number Of Switches
Quad
Off Time (max)
0.1 ms
Operating Supply Voltage
32 V to 60 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Maximum Power Dissipation
2758.6 mW
Minimum Operating Temperature
- 40 C
Operating Supply Current
5 mA
Quad, IEEE 802.3at/af PSE Controller
for Power-over-Ethernet
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to V
AGND ....................................................................-0.3V to +80V
DGND, SVEE_ ......................................................-0.3V to +0.3V
V
OUT_ ....................................................-0.3V to (V
GATE_, SENSE_ ....................................................-0.3V to +22V
A3, A2, A1, A0, MIDSPAN, EN_CL5, AUTO,
Maximum Current into INT and OUT .................................20mA
Maximum Current into OUT_ .......................Internally Regulated
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
ELECTRICAL CHARACTERISTICS
(V
values are at V
otherwise.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
POWER SUPPLIES
Operating Voltage Range
Supply Currents
GATE DRIVER AND CLAMPING
GATE_ Pullup Current
GATE_ Pulldown Current
Strong Pulldown Current
External Gate Drive
CURRENT LIMIT AND OVERCURRENT
Current-Limit Clamp Voltage
DD
INT, SCL, SDAIN, SDAOUT, EN to DGND ..........-0.3V to +6V
AGND
........................ -0.3V to the lower (V
= 32V to 60V, V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
AGND
= 54V, T
EE
EE
= V
, unless otherwise noted.)
DGND
A
= +25NC, and default register settings. Currents are positive when entering the pin, and negative
= 0V, T
SYMBOL
V
V
SU_LIM
I
I
AGND
AGND
V
PDW
I
PDS
I
PU
EE
GS
A
= -40NC to +105NC. All voltages are referenced to V
+ 0.3V) and +4V
AGND
V
V
and all logic inputs unconnected;
V
in power mode after GATE_ pullup
Power mode, gate drive on, V
Port SHDN mode enabled;
V
V
V
Maximum V
allowed during
current-limit
conditions,
V
AGND
OUT_
SCL
GATE_
SENSE_
GATE_
OUT_
= V
+ 0.3V)
= V
= 0V (Note 3)
- V
= V
- V
SDAIN
= 500mV, V
EE
SENSE_
EE
EE
SENSE_
, power mode, gate-drive on
+ 10V
CONDITIONS
= V
= V
Continuous Power Dissipation (T
Package Thermal Resistance (Note 1)
Operating Temperature Range ........................ -40NC to +105NC
Storage Temperature Range ............................ -65NC to +150NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
DD
GATE_
32-Pin TQFN (derate 34.5mW/NC above +70NC) ....2758.6mW
B
B
EE
; measured at AGND
JA
JC
I
set to 80h,
Class 0–3
I
set to C0h,
Class 4
I
set to C0h,
Class 5
LIM_
LIM_
LIM_
; INT, SDAOUT,
............................................................................. +29NC/W
........................................................................... +1.7NC/W
= V
register
register
register
GATE_
EE
+ 2V
= V
EE
MIN
EE
101
200
405
-40
8.5
32
, unless otherwise noted. Typical
A
= +70NC)
106.25
212.5
TYP
430
-50
9.5
40
25
5
111.5
MAX
10.5
225
455
-60
60
7
UNITS
mA
mA
mV
FA
FA
V
V

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