MT48LC32M8A2P-7E:D Micron Technology Inc, MT48LC32M8A2P-7E:D Datasheet - Page 19

• Manufacturer Part Number: MT48LC32M8A2P-7E:D
• Description: IC SDRAM 256MBIT 133MHZ 54TSOP
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC32M8A2P-7E:D

• Package / Case: 54-TSOP II
• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 256M (32M x 8)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Access Time: RoHS Compliant
• Memory Case Style: TSOP
• No. Of Pins: 54
• Operating Temperature Range: 0°C To +70°C
• Operating Temperature Max: 70°C
• Operating Temperature Min: 0°C
• Organization: 32Mx8
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 5.4ns
• Maximum Clock Rate: 143MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 135mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Memory Configuration: 4 BLK (8M X 8)
• Interface Type: LVTTL
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Temperature and Thermal Impedance
Table 5: Temperature Limits
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
Parameter
Operating case temperature
Junction temperature
Ambient temperature
Peak reflow temperature
Notes:
It is imperative that the SDRAM device’s temperature specifications, shown in Table 5
(page 19), be maintained to ensure the junction temperature is in the proper operat-
ing range to meet data sheet specifications. An important step in maintaining the
proper junction temperature is using the device’s thermal impedances correctly. The
thermal impedances are listed in Table 6 (page 20) for the applicable die revision and
packages being made available. These thermal impedance values vary according to the
density, package, and particular design used for each device.
Incorrectly using thermal impedances can produce significant errors. Read Micron tech-
nical note TN-00-08, “Thermal Applications” prior to using the thermal impedances
listed in Table 6 (page 20). To ensure the compatibility of current and future designs,
contact Micron Applications Engineering to confirm thermal impedance values.
The SDRAM device’s safe junction temperature range can be maintained when the T
specification is not exceeded. In applications where the device’s ambient temperature
is too high, use of forced air and/or heat sinks may be required to satisfy the case tem-
perature specifications.
1. MAX operating case temperature, TC, is measured in the center of the package on the
2. Device functionality is not guaranteed if the device exceeds maximum T
3. All temperature specifications must be satisfied.
4. The case temperature should be measured by gluing a thermocouple to the top-center
5. Operating ambient temperature surrounding the package.
top side of the device, as shown in Figure 10 (page 20), Figure 11 (page 21), and Fig-
ure 12 (page 21).
of the component. This should be done with a 1mm bead of conductive epoxy, as de-
fined by the JEDEC EIA/JESD51 standards. Take care to ensure that the thermocouple
bead is touching the case.
Commercial
Industrial
Automotive
Commercial
Industrial
Automotive
Commercial
Industrial
Automotive
19
Symbol
T
PEAK
T
T
T
A
C
J
Temperature and Thermal Impedance
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Min
–40
–40
–40
–40
–40
–40
0
0
0
–
256Mb: x4, x8, x16 SDRAM
Max
105
110
105
260
80
90
85
95
70
85
© 1999 Micron Technology, Inc. All rights reserved.
Unit
°C
°C
°C
°C
C
during operation.
1, 2, 3, 4
Notes
3, 5
3
C