US38024-BAG1 Renesas Electronics America, US38024-BAG1 Datasheet - Page 37

• Manufacturer Part Number: US38024-BAG1
• Description: DEV EVALUATION KIT H8/38024
• Manufacturer: Renesas Electronics America
• Series: H8®r
• Type: MCUr

Specifications of US38024-BAG1

• Contents: 2G (Second-generation) Evaluation Board, HEW debugger support, Cable and CD-ROM
• For Use With/related Products: H8/38024
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Figure 1.6 Bonding Pad Location Diagram of HCD64F38024, HCD64F38024R (Top View)
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Chip size: 3.84 mm × 4.24 mm
Voltage level on the back of the chip: GND
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: NC pad
Rev. 8.00 Mar. 09, 2010 Page 15 of 658
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Type code
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Section 1 Overview
REJ09B0042-0800
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