PIC12C672-10/SM Microchip Technology, PIC12C672-10/SM Datasheet - Page 42

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PIC12C672-10/SM

Manufacturer Part Number
PIC12C672-10/SM
Description
IC MCU OTP 2KX14 A/D 8-SOIJ
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets

Specifications of PIC12C672-10/SM

Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
For Use With
XLT08SO-1 - SOCKET TRANSITION 8SOIC 150/208AC164312 - MODULE SKT FOR PM3 16SOICISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1048 - ADAPTER 8-SOIC TO 8-DIP309-1047 - ADAPTER 8-SOIC TO 8-DIPAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
Other names
PIC12C672-10/SMR
PIC12C672-10/SMR
PICmicro MID-RANGE MCU FAMILY
2.4
2.4.1
DS31002A-page 2-12
RC Start-up
External RC Oscillator
For timing insensitive applications the “EXTRC” device option offers additional cost savings. The
RC oscillator frequency is a function of; the supply voltage, the resistor (R
(C
from unit to unit due to normal process parameter variation. Furthermore, the difference in lead
frame capacitance between package types will also affect the oscillation frequency, especially for
low C
R
PIC16CXXX. For R
completely. For very high R
humidity and leakage. Thus, we recommend keeping R
Figure 2-6: EXTRC Oscillator Mode
Although the oscillator will operate with no external capacitor (C
using values above 20 pF for noise and stability reasons. With no or small external capacitance,
the oscillation frequency can vary dramatically due to changes in external capacitances, such as
PCB trace capacitance and package lead frame capacitance.
See characterization data for RC frequency variation from part to part due to normal process
variation. The variation is larger for larger resistance (since leakage current variation will affect
RC frequency more for large R) and for smaller capacitance (since variation of input capacitance
will affect RC frequency more).
See characterization data for variation of oscillator frequency due to V
values as well as frequency variation due to operating temperature for given R
V
The oscillator frequency, divided by 4, is available on the OSC2/CLKOUT pin, and can be used
for test purposes or to synchronize other logic (see
the
As the device voltage increases, the RC will start its oscillations immediately after the pin voltage
levels meet the input threshold specifications
Specifications”
tors. These include:
• Resistor value used
• Capacitor value used
• Device V
• System temperature
DD
EXT
EXT
Note 1: This output may also be able to be configured as a general purpose I/O pin.
“Architecture”
values.
EXT
) values, and the operating temperature. In addition to this, the oscillator frequency will vary
and C
values. The user also needs to take into account variation due to tolerance of external
DD
EXT
rise time
components used.
section). The time required for the RC to start oscillating depends on many fac-
EXT
section, for waveform).
C
R
V
values below 2.2 k , oscillator operation may become unstable, or stop
EXT
SS
EXT
V
EXT
DD
values (e.g. 1 M ), the oscillator becomes sensitive to noise,
Fosc/4
Figure 2-6
(1)
OSC1
OSC2/CLKOUT
shows how the RC combination is connected to a
(parameters D032
Figure 4-3: "Clock/Instruction Cycle"
EXT
Fosc
between 3 k and 100 k .
PIC16CXXX
Internal
clock
EXT
and
1997 Microchip Technology Inc.
= 0 pF), we recommend
D042
DD
for given R
EXT
in the
) and capacitor
EXT
, C
“Electrical
EXT
EXT
/C
, and
EXT
in

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