DSPIC30F3013-30I/SO Microchip Technology, DSPIC30F3013-30I/SO Datasheet - Page 14

IC DSPIC MCU/DSP 24K 28SOIC

DSPIC30F3013-30I/SO

Manufacturer Part Number
DSPIC30F3013-30I/SO
Description
IC DSPIC MCU/DSP 24K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F3013-30I/SO

Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F301330ISO

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F3013-30I/SO
Manufacturer:
NSC
Quantity:
340
Part Number:
DSPIC30F3013-30I/SO
Manufacturer:
PIC
Quantity:
20 000
dsPIC30F
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On-Line Support................................................................................................................................................................................. 239
Systems Information and Upgrade Hot Line ...................................................................................................................................... 239
Reader Response .............................................................................................................................................................................. 240
Product Identification System............................................................................................................................................................. 241
DS70082G-page 12
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Device Overview .................................................................................................................................................................... 13
CPU Architecture Overview.................................................................................................................................................... 19
Memory Organization ............................................................................................................................................................. 31
Address Generator Units........................................................................................................................................................ 43
Interrupts ................................................................................................................................................................................ 51
Flash Program Memory.......................................................................................................................................................... 57
Data EEPROM Memory ......................................................................................................................................................... 63
I/O Ports ................................................................................................................................................................................. 67
Timer1 Module ....................................................................................................................................................................... 73
Timer2/3 Module .................................................................................................................................................................... 77
Timer4/5 Module ................................................................................................................................................................... 83
Input Capture Module............................................................................................................................................................. 87
Output Compare Module ........................................................................................................................................................ 91
Quadrature Encoder Interface (QEI) Module ......................................................................................................................... 95
Motor Control PWM Module ................................................................................................................................................. 101
SPI™ Module ....................................................................................................................................................................... 111
I2C Module ........................................................................................................................................................................... 115
Universal Asynchronous Receiver Transmitter (UART) Module .......................................................................................... 123
CAN Module ......................................................................................................................................................................... 131
10-bit High Speed Analog-to-Digital Converter (A/D) Module .............................................................................................. 143
System Integration ............................................................................................................................................................... 151
Instruction Set Summary ...................................................................................................................................................... 165
Development Support........................................................................................................................................................... 173
Electrical Characteristics ...................................................................................................................................................... 179
Packaging Information.......................................................................................................................................................... 221
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Preliminary
 2004 Microchip Technology Inc.

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