DSPIC30F3013-30I/SO Microchip Technology, DSPIC30F3013-30I/SO Datasheet - Page 234

• Manufacturer Part Number: DSPIC30F3013-30I/SO
• Description: IC DSPIC MCU/DSP 24K 28SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3013-30I/SO

• Program Memory Type: FLASH
• Program Memory Size: 24KB (8K x 24)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 20
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 30
• Data Ram Size: 2 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F301330ISO

dsPIC30F
80-Lead Plastic Thin Quad Flatpack 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70082G-page 232
B
c
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-116
β
*Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
p
Dimension Limits
#leads=n1
E1
E
Units
n1
A2
E1
D1
A1
(F)
E
D
B
n
p
A
φ
c
α
β
L
n
MIN
.037
.002
.018
.004
Preliminary
.011
11
11
0
2
1
φ
.630 BSC
.630 BSC
.551 BSC
.551 BSC
INCHES
D1
L
NOM
D
.024
.026
.039
.039
.013
3.5
80
20
12
12
A
A1
MAX
.047
.006
.030
.008
.015
.041
13
13
7
(F)
MIN
0.95
0.05
0.45
0.09
0.27
11
11
0
MILLIMETERS*
 2004 Microchip Technology Inc.
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
NOM
0.65
1.00
0.60
1.00
0.32
3.5
80
20
12
12
MAX
A2
1.20
1.05
0.15
0.75
0.20
0.37
13
13
7
α