DSPIC30F3013-30I/SO Microchip Technology, DSPIC30F3013-30I/SO Datasheet - Page 210

• Manufacturer Part Number: DSPIC30F3013-30I/SO
• Description: IC DSPIC MCU/DSP 24K 28SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3013-30I/SO

• Program Memory Type: FLASH
• Program Memory Size: 24KB (8K x 24)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 20
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 30 MHz
• Number Of Programmable I/os: 30
• Data Ram Size: 2 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F301330ISO

dsPIC30F
FIGURE 24-19:
TABLE 24-31: SPI MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS
DS70082G-page 208
AC CHARACTERISTICS
SP70
SP71
SP20
SP21
SP30
SP31
SP35
SP40
SP41
SP50
SP51
SP52
Note 1:
Param
No.
2:
3:
Note: Refer to Figure 24-3 for load conditions.
(CKP = 0)
(CKP = 1)
SDI
SDI
SCK
SDO
SS
SCK
X
X
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
TssL2scH,
TssL2scL
TssH2doZ SS
TscH2ssH
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
Assumes 50 pF load on all SPI pins.
X
TscL2ssH
X
X
Symbol
SPI MODULE SLAVE MODE (CKE = 0) TIMING CHARACTERISTICS
SCK
SCK
SCK
SCK
SDO
SDO
SDO
SCK
Setup Time of SDI
to SCK
Hold Time of SDI
to SCK
SS
Hi-Impedance
SS
SP50
X
X
X
↓ to SCK
↑ to SDO
X
X
X
X
X
X
X
X
after SCK Edge
Input Low Time
Input High Time
Output Fall Time
Output Rise Time
Edge
Data Output Fall Time
Data Output Rise Time
Data Output Valid after
SP35
X
X
Characteristic
SP71
Edge
Edge
SP40
X
X
(3)
↑ or SCK
Output
MSb IN
X
MSb
SP41
X
SP70
Data Input
Data Input
(1)
(3)
(3)
X
SP30,SP31
↓ Input
Preliminary
(3)
(3)
1.5 T
BIT14 - - - - - -1
BIT14 - - - -1
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
Min
120
30
30
20
20
10
—
—
—
—
—
CY
+40
SP20
SP20
Typ
—
—
10
10
10
10
—
—
—
—
—
—
(2)
SP21
SP21
LSb
LSb IN
SP52
-40°C ≤ T
-40°C ≤ T
Max
—
—
25
25
25
25
30
—
—
—
50
—
 2004 Microchip Technology Inc.
SP51
A
A
Units
≤ +85°C for Industrial
≤ +125°C for Extended
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Conditions
—
—
—
—
—
—
—
—
—
—
—
—