DSPIC30F3013-30I/SO Microchip Technology, DSPIC30F3013-30I/SO Datasheet - Page 193
DSPIC30F3013-30I/SO
Manufacturer Part Number
DSPIC30F3013-30I/SO
Description
IC DSPIC MCU/DSP 24K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(210 pages)
2.DSPIC30F2011-20ISO.pdf
(6 pages)
3.DSPIC30F3012-20ISO.pdf
(14 pages)
4.DSPIC30F3012-20ISO.pdf
(20 pages)
5.DSPIC30F3014-30IP.pdf
(244 pages)
Specifications of DSPIC30F3013-30I/SO
Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F301330ISO
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F3013-30I/SO
Manufacturer:
NSC
Quantity:
340
Part Number:
DSPIC30F3013-30I/SO
Manufacturer:
PIC
Quantity:
20 000
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F2011-20ISO PDF datasheet #2
- DSPIC30F3012-20ISO PDF datasheet #3
- DSPIC30F3012-20ISO PDF datasheet #4
- DSPIC30F3014-30IP PDF datasheet #5
- Current page: 193 of 244
- Download datasheet (7Mb)
TABLE 24-9:
TABLE 24-10: DC CHARACTERISTICS: PROGRAM AND EEPROM
2004 Microchip Technology Inc.
DC CHARACTERISTICS
BO10
BO15
Note 1:
DC CHARACTERISTICS
D120
D121
D122
D123
D124
D130
D131
D132
D133
D134
D135
D136
D137
D138
Note 1:
Param
Param
No.
No.
2:
3:
2:
E
V
T
T
I
E
V
V
V
T
T
T
I
I
Symbol
DEW
PEW
EB
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
00 values not in usable operating range.
EB
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
These parameters are characterized but not tested in manufacturing.
DEW
RETD
EB
PEW
RETD
D
DRW
P
PR
PEW
V
V
Symbol
BOR
BHYS
ELECTRICAL CHARACTERISTICS: BOR
Data EEPROM Memory
Byte Endurance
V
Erase/Write Cycle Time
Characteristic Retention
I
Program FLASH Memory
Cell Endurance
V
V
V
Erase/Write Cycle Time
Characteristic Retention
ICSP Block Erase Time
I
I
DD
DD
DD
DD
DD
DD
DD
BOR Voltage
V
low
During Programming
During Programming
During Programming
for Read/Write
for Read
for Block Erase
for Erase/Write
DD
Characteristic
transition high to
Characteristic
(2)
on
(2)
(2)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
BORV = 00
BORV = 01
BORV = 10
BORV = 11
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
100K
Preliminary
V
V
10K
Min
3.0
3.0
40
40
—
—
—
—
—
—
MIN
MIN
Typ
100K
(3)
100
100
1M
10
10
10
—
—
—
—
2
2
4
(1)
Min
2.7
4.2
4.5
—
—
Max
5.5
5.5
5.5
5.5
—
—
—
30
—
—
—
—
30
30
Typ
-40°C ≤ T
-40°C ≤ T
—
—
—
—
5
-40°C ≤ T
-40°C ≤ T
Units
(1)
Year Provided no other specifications
Year Provided no other specifications
E/W
E/W
mA
mA
mA
ms
ms
ms
V
V
V
V
Max
2.86
4.46
4.78
A
A
—
—
-40°C ≤ T
Using EECON to read/write
V
voltage
are violated
Row Erase
-40°C ≤ T
V
voltage
are violated
Row Erase
Bulk Erase
≤ +85°C for Industrial
≤ +125°C for Extended
MIN
MIN
A
A
≤ +85°C for Industrial
≤ +125°C for Extended
= Minimum operating
= Minimum operating
Units
mV
V
V
V
V
dsPIC30F
A
A
Conditions
≤ +85°C
≤ +85°C
Not in operating
range
DS70082G-page 191
Conditions
Related parts for DSPIC30F3013-30I/SO
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
MODULE DSPIC30F SAMPLE 64QFP
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
MODULE DSPIC30F SAMPLE 80QFP
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
MPLAB C Compiler For DsPIC DSCs
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
DEVICE ATP FOR ICE4000
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
DEVICE ATP FOR ICE4000
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
DEVICE ATP FOR ICE4000
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
MODULE PLUG-IN PIC18F4431
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC, DSC, 16BIT, 12KB 40MHZ, 5.5V, SOIC28
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC, DSC, 16BIT, 24KB 40MHZ, 5.5V, TQFP44
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC, DSC, 16BIT, 48KB, 40MHZ, 5.5V, DIP40
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC, DSC, 16BIT, 48KB 20MHZ, 5.5V, SOIC28
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC, DSC, 16BIT, 66KB, 40MHZ 5.5V TQFP-64
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
IC, DSC, 16BIT, 12KB, 40MHZ, 5.5V, QFN28
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
16BIT 30MIPS DSPIC, 30F2010, DIP28
Manufacturer:
Microchip Technology
Datasheet:
Part Number:
Description:
16BIT MCU-DSP 30MHZ, SMD, 30F5011
Manufacturer:
Microchip Technology
Datasheet: