MC68HC705JP7CDW Freescale Semiconductor, MC68HC705JP7CDW Datasheet - Page 157

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MC68HC705JP7CDW

Manufacturer Part Number
MC68HC705JP7CDW
Description
IC MCU 8BIT 28-SOIC
Manufacturer
Freescale Semiconductor
Series
HC05r
Datasheet

Specifications of MC68HC705JP7CDW

Core Processor
HC05
Core Size
8-Bit
Speed
2.1MHz
Connectivity
SIO
Peripherals
POR, Temp Sensor, WDT
Number Of I /o
22
Program Memory Size
6KB (6K x 8)
Program Memory Type
OTP
Ram Size
224 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 4x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Chapter 16
Mechanical Specifications
16.1 Introduction
The MC68HC705JJ7 is available in:
The MC68HC705JP7 is available in:
The following figures show the latest package drawings at the time of this publication. To make sure that
you have the latest package specifications, contact your local Freescale Sales Office.
16.2 20-Pin Plastic Dual In-Line Package (Case 738)
Freescale Semiconductor
SEATING
PLANE
-T-
20-pin plastic dual in-line package (PDIP)
20-pin small outline integrated circuit (SOIC) package
20-pin windowed ceramic package
28-pin plastic dual in-line package (PDIP)
28-pin small outline integrated circuit (SOIC) package
28-pin windowed ceramic package
20
1
G
E
MC68HC705JJ7 • MC68HC705JP7 Advance Information Data Sheet, Rev. 4.1
F
-A-
D
20 PL
11
10
0.25 (0.010)
N
B
K
M
C
T A
M
J
L
20 PL
0.25 (0.010)
M
M
T B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
DIM
A
B
C
D
G
K
M
N
E
F
J
L
1.010
0.240
0.150
0.015
0.050
0.008
0.110
0.020
MIN
0.050 BSC
0.100 BSC
0.300 BSC
INCHES
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
MAX
15°
MILLIMETERS
25.66
MIN
6.10
3.81
0.39
1.27
0.21
2.80
0.51
1.27 BSC
2.54 BSC
7.62 BSC
27.17
MAX
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15°
157

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