AGLN030V2-ZVQG100 Actel, AGLN030V2-ZVQG100 Datasheet - Page 20

• Manufacturer Part Number: AGLN030V2-ZVQG100
• Description: FPGA - Field Programmable Gate Array 30K System Gates IGLOO nano
• Manufacturer: Actel

Specifications of AGLN030V2-ZVQG100

• Processor Series: AGLN030
• Core: IP Core
• Number Of Macrocells: 256
• Maximum Operating Frequency: 250 MHz
• Number Of Programmable I/os: 77
• Supply Voltage (max): 1.5 V
• Supply Current: 6 uA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 20 C
• Development Tools By Supplier: AGLN-Nano-Kit, AGLN-Z-Nano-Kit, AGL-Dev-Kit-SCS, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, FLASHPRO 4, FlashPro 3, FLASHPRO LITE
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.2 V
• Number Of Gates: 30 K
• Package / Case: VQFP-100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

IGLOO nano DC and Switching Characteristics
Table 2-5 •
Table 2-6 •
2- 6
Package Type
Chip Scale Package (CSP)
Quad Flat No Lead (QFN)
Very Thin Quad Flat Pack (VQFP)
Array Voltage
VCC (V)
1.425
1.5
1.575
Maximum Power Allowed
V
CC
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1
where:
T
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
θ
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θ
θ
temperature is 100°C.
allowed for a 484-pin FBGA package at commercial temperature and in still air.
Temperature and Voltage Derating Factors
Package Thermal Resistivities
Temperature and Voltage Derating Factors for Timing Delays (normalized to T
For IGLOO nano V2 or V5 Devices, 1.5 V DC Core Supply Voltage
A
ja
ja
= 1.425 V)
. The thermal characteristics for θ
= Ambient temperature
= Junction-to-ambient of the package. θ
T
J
can be used to calculate junction temperature.
= Junction Temperature = ΔT + T
–40°C
0.947
0.875
0.821
=
Max. junction temp. (°C) Max. ambient temp. (°C)
-------------------------------------------------------------------------------------------------------------------------------------- -
–20°C
0.956
0.883
0.829
EQ 2
shows a sample calculation of the maximum operating power dissipation
Count
100
100
Pin
36
81
48
68
ja
0.965
0.892
0.837
0°C
are shown for two air flow rates. The maximum operating junction
A
Junction Temperature (°C)
θ
ja
ja
(°C/W)
R ev isio n 1 1
numbers are located in
–
TBD
TBD
TBD
TBD
TBD
10.0
θ
jc
jc
0.978
0.904
0.848
25°C
and the junction-to-ambient air thermal resistivity is
Still Air
TBD
TBD
TBD
TBD
TBD
35.3
1.000
0.925
0.868
70°C
Figure
200 ft./
=
min.
TBD
TBD
TBD
TBD
TBD
29.4
θ
ja
ja
100°C 70°C
------------------------------------
* P
2-5.
20.5°C/W
1.009
0.932
0.875
–
85°C
J
500 ft./
min.
TBD
TBD
TBD
TBD
TBD
27.1
= 70°C,
=
1.46 W
100°C
1.013
0.937
0.879
Units
C/W
C/W
C/W
C/W
C/W
C/W
EQ 1
EQ 2