MT41J256M8HX-15E:D Micron Technology Inc, MT41J256M8HX-15E:D Datasheet - Page 9

no-image

MT41J256M8HX-15E:D

Manufacturer Part Number
MT41J256M8HX-15E:D
Description
MICMT41J256M8HX-15E:D 2GB:X4,X8,X16 DDR3
Manufacturer
Micron Technology Inc
Type
DDR3 SDRAMr
Series
-r
Datasheets

Specifications of MT41J256M8HX-15E:D

Organization
256Mx8
Address Bus
18b
Maximum Clock Rate
1.333GHz
Operating Supply Voltage (typ)
1.5V
Package Type
FBGA
Operating Temp Range
0C to 95C
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Supply Current
165mA
Pin Count
78
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Format - Memory
RAM
Memory Type
DDR3 SDRAM
Memory Size
2G (256M x 8)
Speed
667MHz
Interface
Parallel
Voltage - Supply
1.425 V ~ 1.575 V
Operating Temperature
0°C ~ 95°C
Package / Case
78-TFBGA
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT41J256M8HX-15E:D
Manufacturer:
SAMSUNG
Quantity:
1 001
Part Number:
MT41J256M8HX-15E:D
Manufacturer:
MICRON
Quantity:
11 200
Part Number:
MT41J256M8HX-15E:D
Manufacturer:
MICRON21
Quantity:
1 684
Part Number:
MT41J256M8HX-15E:D
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT41J256M8HX-15E:D
Manufacturer:
MICRON/美光
Quantity:
20 000
Company:
Part Number:
MT41J256M8HX-15E:D
Quantity:
5 845
Part Number:
MT41J256M8HX-15E:D TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Figure 51: MRS to nonMRS Command Timing (
Figure 52: Mode Register 0 (MR0) Definitions ................................................................................................ 134
Figure 53: READ Latency .............................................................................................................................. 136
Figure 54: Mode Register 1 (MR1) Definition ................................................................................................. 137
Figure 55: READ Latency (AL = 5, CL = 6) ....................................................................................................... 140
Figure 56: Mode Register 2 (MR2) Definition ................................................................................................. 141
Figure 57: CAS Write Latency ........................................................................................................................ 142
Figure 58: Mode Register 3 (MR3) Definition ................................................................................................. 144
Figure 59: Multipurpose Register (MPR) Block Diagram ................................................................................. 145
Figure 60: MPR System Read Calibration with BL8: Fixed Burst Order Single Readout ..................................... 147
Figure 61: MPR System Read Calibration with BL8: Fixed Burst Order, Back-to-Back Readout ......................... 148
Figure 62: MPR System Read Calibration with BC4: Lower Nibble, Then Upper Nibble ................................... 149
Figure 63: MPR System Read Calibration with BC4: Upper Nibble, Then Lower Nibble ................................... 150
Figure 64: ZQ Calibration Timing (ZQCL and ZQCS) ...................................................................................... 152
Figure 65: Example: Meeting
Figure 66: Example:
Figure 67: READ Latency .............................................................................................................................. 155
Figure 68: Consecutive READ Bursts (BL8) .................................................................................................... 157
Figure 69: Consecutive READ Bursts (BC4) .................................................................................................... 157
Figure 70: Nonconsecutive READ Bursts ....................................................................................................... 158
Figure 71: READ (BL8) to WRITE (BL8) .......................................................................................................... 158
Figure 72: READ (BC4) to WRITE (BC4) OTF .................................................................................................. 159
Figure 73: READ to PRECHARGE (BL8) ......................................................................................................... 159
Figure 74: READ to PRECHARGE (BC4) ......................................................................................................... 160
Figure 75: READ to PRECHARGE (AL = 5, CL = 6) ........................................................................................... 160
Figure 76: READ with Auto Precharge (AL = 4, CL = 6) .................................................................................... 160
Figure 77: Data Output Timing –
Figure 78: Data Strobe Timing – READs ......................................................................................................... 163
Figure 79: Method for Calculating
Figure 80:
Figure 81:
Figure 82:
Figure 83:
Figure 84: WRITE Burst ................................................................................................................................ 168
Figure 85: Consecutive WRITE (BL8) to WRITE (BL8) ..................................................................................... 169
Figure 86: Consecutive WRITE (BC4) to WRITE (BC4) via MRS or OTF ............................................................ 169
Figure 87: Nonconsecutive WRITE to WRITE ................................................................................................. 170
Figure 88: WRITE (BL8) to READ (BL8) .......................................................................................................... 170
Figure 89: WRITE to READ (BC4 Mode Register Setting) ................................................................................. 171
Figure 90: WRITE (BC4 OTF) to READ (BC4 OTF) ........................................................................................... 172
Figure 91: WRITE (BL8) to PRECHARGE ........................................................................................................ 173
Figure 92: WRITE (BC4 Mode Register Setting) to PRECHARGE ...................................................................... 173
Figure 93: WRITE (BC4 OTF) to PRECHARGE ................................................................................................ 174
Figure 94: Data Input Timing ........................................................................................................................ 175
Figure 95: Self Refresh Entry/Exit Timing ...................................................................................................... 177
Figure 96: Active Power-Down Entry and Exit ................................................................................................ 181
Figure 97: Precharge Power-Down (Fast-Exit Mode) Entry and Exit ................................................................ 182
Figure 98: Precharge Power-Down (Slow-Exit Mode) Entry and Exit ............................................................... 182
Figure 99: Power-Down Entry After READ or READ with Auto Precharge (RDAP) ............................................ 183
Figure 100: Power-Down Entry After WRITE .................................................................................................. 183
Figure 101: Power-Down Entry After WRITE with Auto Precharge (WRAP) ...................................................... 184
Figure 102: REFRESH to Power-Down Entry .................................................................................................. 184
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
t
t
t
t
RPRE Timing ............................................................................................................................... 164
RPST Timing ............................................................................................................................... 165
WPRE Timing .............................................................................................................................. 167
WPST Timing .............................................................................................................................. 167
t
FAW ............................................................................................................................. 154
t
RRD (MIN) and
t
DQSQ and Data Valid Window ................................................................... 162
t
LZ and
t
HZ .............................................................................................. 164
t
RCD (MIN) ............................................................................. 153
t
MOD) .................................................................................. 133
9
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2Gb: x4, x8, x16 DDR3 SDRAM
© 2006 Micron Technology, Inc. All rights reserved.

Related parts for MT41J256M8HX-15E:D