MT41J256M8HX-15E:D Micron Technology Inc, MT41J256M8HX-15E:D Datasheet - Page 96

• Manufacturer Part Number: MT41J256M8HX-15E:D
• Description: MICMT41J256M8HX-15E:D 2GB:X4,X8,X16 DDR3
• Manufacturer: Micron Technology Inc
• Type: DDR3 SDRAMr
• Series: -r

Specifications of MT41J256M8HX-15E:D

• Organization: 256Mx8
• Address Bus: 18b
• Maximum Clock Rate: 1.333GHz
• Operating Supply Voltage (typ): 1.5V
• Package Type: FBGA
• Operating Temp Range: 0C to 95C
• Operating Supply Voltage (max): 1.575V
• Operating Supply Voltage (min): 1.425V
• Supply Current: 165mA
• Pin Count: 78
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Format - Memory: RAM
• Memory Type: DDR3 SDRAM
• Memory Size: 2G (256M x 8)
• Speed: 667MHz
• Interface: Parallel
• Voltage - Supply: 1.425 V ~ 1.575 V
• Operating Temperature: 0°C ~ 95°C
• Package / Case: 78-TFBGA
• Lead Free Status / RoHS Status: Compliant

PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
37. Although CKE is allowed to be registered LOW after a REFRESH command when
38. ODT turn-on time MIN is when the device leaves High-Z and ODT resistance begins to
39. Half-clock output parameters must be derated by the actual
40. ODT turn-off time minimum is when the device starts to turn off ODT resistance. ODT turn-
41. Pulse width of a input signal is defined as the width between the first crossing of
42. Should the clock rate be larger than
FPDEN (MIN) is satisfied, there are cases where additional time such as
required.
turn on. ODT turn-on time maximum is when the ODT resistance is fully on. The ODT
reference load is shown in Figure 22 (page 57).
input clock jitter is present. This results in each parameter becoming larger. The parame-
ters
t
required to be derated by subtracting both
off time maximum is when the DRAM buffer is in High-Z. The ODT reference load is
shown in Figure 23 (page 60). This output load is used for ODT timings (see Figure 30
(page 71)).
V
have at least one NOP command between it and another AUTO REFRESH command. Ad-
ditionally, if the clock rate is slower than 40ns (25 MHz), all REFRESH commands should
be followed by a PRECHARGE ALL command.
ERR
REF(DC)
t
10
ADC (MIN) and
PER (MAX) and
and the consecutive crossing of V
t
AOF (MIN) are each required to be derated by subtracting both
t
JITdty (MAX). The parameters
96
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
RFC (MIN), an AUTO REFRESH command should
REF(DC)
t
2Gb: x4, x8, x16 DDR3 SDRAM
ERR
.
10
PER (MAX) and
t
ADC (MAX) and
t
© 2006 Micron Technology, Inc. All rights reserved.
ERR
10
t
JITdty (MAX).
PER and
t
AOF (MAX) are
t
XPDLL (MIN) is
t
JITdty when
t
RE-