MT48H32M16LFBF-75 IT:B Micron Technology Inc, MT48H32M16LFBF-75 IT:B Datasheet - Page 13

• Manufacturer Part Number: MT48H32M16LFBF-75 IT:B
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48H32M16LFBF-75 IT:B

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 8/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 90mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Package Dimensions
Figure 5: 54-Ball VFBGA (8mm x 9mm)
PDF: 09005aef82ea3742
512mb_mobile_sdram_y47m.pdf – Rev. H 12/09 EN
condition. The pre-
diameter refers
reflow balls are
SMD ball pads.
Ø0.42 on Ø0.4
to post reflow
54X Ø0.45
Seating
plane
6.4
Solder ball
0.1 A
0.8 TYP
3.2
Note:
A
9
1. 1. All dimensions are in millimeters.
8
3.2
7
8 ±0.1
6.4
3
4 ±0.05
2
1
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
A
B
C
D
E
F
G
H
J
0.8
TYP
4.5 ±0.05
0.65 ±0.05
13
Ball A1 ID
9 ± 0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.0 MAX
Mold compound: epoxy novolac
Solder ball material:
Substrate material: plastic laminate
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
© 2007 Micron Technology, Inc. All rights reserved.
Micron logo
to be lased
ball A1 ID