MT48H32M16LFBF-75 IT:B Micron Technology Inc, MT48H32M16LFBF-75 IT:B Datasheet - Page 65

MT48H32M16LFBF-75 IT:B

Manufacturer Part Number
MT48H32M16LFBF-75 IT:B
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48H32M16LFBF-75 IT:B

Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
8/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
90mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
Figure 35: READ With Auto Precharge Interrupted by a READ
PDF: 09005aef82ea3742
512mb_mobile_sdram_y47m.pdf – Rev. H 12/09 EN
Internal
states
Command
Note:
Address
Bank m
Bank n
CLK
DQ
WRITE with auto precharge interrupted by a WRITE (with or without auto precharge)
A WRITE to bank m will interrupt a WRITE on bank n when registered. The precharge to
bank n will begin after
registered. The last valid data WRITE to bank n will be data registered one clock prior to
a WRITE to bank m (see Figure 42 (page 71)).
1. DQM is LOW.
Page active
NOP
T0
READ - AP
Page active
Bank n,
Bank n
T1
Col a
READ with burst of 4
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
t
WR is met, where
T2
CL = 3 (bank n)
NOP
65
READ - AP
Bank m,
T3
Bank m
Col d
Interrupt burst, precharge
READ with burst of 4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
T4
WR begins when the WRITE to bank m is
CL = 3 (bank m)
NOP
t
RP - bank n
D
OUT
T5
NOP
D
OUT
PRECHARGE Operation
T6
NOP
D
© 2007 Micron Technology, Inc. All rights reserved.
OUT
Idle
T7
Don’t Care
NOP
t RP - bank m
D
Precharge
OUT

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