MT48H32M16LFBF-75 IT:B Micron Technology Inc, MT48H32M16LFBF-75 IT:B Datasheet - Page 85

• Manufacturer Part Number: MT48H32M16LFBF-75 IT:B
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48H32M16LFBF-75 IT:B

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 8/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 90mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Revision History
Rev. H, Production – 12/09
Rev. G, Production – 8/09
Rev. F, Production – 4/09
Rev. E, Production – 3/09
Rev. D, Production – 2/09
Rev. C, Production – 12/08
Rev. B, Preliminary – 4/08
Rev. A, Advance – 10/07
PDF: 09005aef82ea3742
512mb_mobile_sdram_y47m.pdf – Rev. H 12/09 EN
• Changed
• Updated format.
• AC Functional Characteristics table: Updated note 9.
• Typical I
• VFBGA Ball Descriptions table: Deleted ballout columns.
• I
• AC Functional Characteristics table: Corrected typographical error in heading.
• Options section: Added low-power option.
• 512Mb Mobile LPSDR Part Numbering figure: Added low-power option.
• I
• I
• I
• I
• Electrical Characteristics and Recommended AC Operating Conditions table: Upda-
• Target Output Drive Characteristics (Full Strength), Target Output Drive Characteris-
• Initial release.
tables: Updated values.
low-power option.
auto refresh current to
refresh current to
ted values for
tics (Three-Quarter Strength), and Target Output Drive Characteristics (One-Half
Strength) tables: Added drive-strength tables.
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Specifications and Conditions (x16) and I
Specifications and Conditions (x16) table: Updated I
Specifications and Conditions (x32): Updated I
Specifications and Conditions (x16 and x32) table: Added column with values for
Curves figure: Added figure.
DD7
t
RFC from 97.5ns to 72ns in Table 10 (page 20).
Curves figure: Changed current units on y-axis from mA to µA.
t
CH,
t
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
RFC = 110ns.
t
CL.
t
RFC = 110ns.
85
Micron Technology, Inc. reserves the right to change products or specifications without notice.
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Specifications and Conditions (x32)
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values and changed I
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values and changed I
© 2007 Micron Technology, Inc. All rights reserved.
Revision History
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