KMC7457VG1267LC Freescale Semiconductor, KMC7457VG1267LC Datasheet - Page 43

• Manufacturer Part Number: KMC7457VG1267LC
• Description: IC MPU RISC 32BIT 1267MHZ 483BGA
• Manufacturer: Freescale Semiconductor

Specifications of KMC7457VG1267LC

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 1.267GHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 483-FCCBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

8
The following sections provide the package parameters and mechanical dimensions for the CBGA
package.
8.1
The package parameters are as provided in the following list. The package type is 25
ceramic ball grid array (CBGA).
Freescale Semiconductor
Package Description
Package outline
Interconnects
Pitch
Minimum module height 2.72 mm
Maximum module height3.24 mm
Ball diameter
Package Parameters for the MPC7447, 360 CBGA
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 7
25
360 (19
1.27 mm (50 mil)
0.89 mm (35 mil)
×
25 mm
×
19 ball array – 1)
×
25 mm, 360-lead
Package Description
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