KMC7457VG1267LC Freescale Semiconductor, KMC7457VG1267LC Datasheet - Page 62

• Manufacturer Part Number: KMC7457VG1267LC
• Description: IC MPU RISC 32BIT 1267MHZ 483BGA
• Manufacturer: Freescale Semiconductor

Specifications of KMC7457VG1267LC

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 1.267GHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 483-FCCBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

System Design Information
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
9.8.3
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
where:
During operation, the die-junction temperatures (T
Table
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T
may range from 30° to 40°C. The air temperature rise within a cabinet (T
10°C. The thermal resistance of the thermal interface material (R
62
4. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
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T
T
T
R
R
R
P
r
d
j
I
θJC
θint
θsa
is the die-junction temperature
is the inlet cabinet ambient temperature
is the air temperature rise within the computer cabinet
is the power dissipated by the device
Heat Sink Selection Example
is the heat sink base-to-ambient thermal resistance
is the junction-to-case thermal resistance
is the adhesive or interface material thermal resistance
T
j
th
= T
St.
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 7
I
+ T
r
+ (R
θJC
+ R
θint
+ R
j
) should be maintained less than the value specified in
θsa
)
×
P
d
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θint
) is typically about 1.5°C/W. For
r
) may be in the range of 5° to
Freescale Semiconductor
a
)