NAND512R3A2CZA6E Micron Technology Inc, NAND512R3A2CZA6E Datasheet - Page 49

• Manufacturer Part Number: NAND512R3A2CZA6E
• Manufacturer: Micron Technology Inc

Specifications of NAND512R3A2CZA6E

• Cell Type: NAND
• Density: 512Mb
• Access Time (max): 15us
• Interface Type: Parallel
• Address Bus: 26b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: VFBGA
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 1.95V
• Word Size: 8b
• Number Of Words: 64M
• Supply Current: 15mA
• Mounting: Surface Mount
• Pin Count: 63
• Lead Free Status / Rohs Status: Compliant

NAND512-A2C
11
Figure 37. TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package outline
1. Drawing is not to scale.
Table 22.
Symbol
CP
A1
A2
D1
E1
L1
A
B
C
E
α
e
L
Package mechanical
To meet environmental requirements, Numonyx offers these devices in RoHS compliant
packages, which have a lead-free second-level interconnect. The category of second-level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label.
RoHS compliant specifications are available at www.numonyx.com.
TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, mechanical data
D1
DIE
24
1
12.00
20.00
18.40
0.10
1.00
0.22
0.50
0.60
0.80
Typ
3°
millimeters
E1
11.90
19.80
18.30
E
0.05
0.95
0.17
0.50
0.10
Min
0°
–
12.10
20.20
18.50
Max
1.20
0.15
1.05
0.27
0.21
0.08
0.70
5°
–
48
25
C
B
e
A2
CP
0.004
0.039
0.009
0.472
0.787
0.724
0.020
0.024
0.031
Typ
3°
A1
L1
inches
0.002
0.037
0.007
0.004
0.468
0.779
0.720
0.020
L
Min
0°
–
Package mechanical
TSOP-G
A
0.006
0.041
0.011
0.003
0.476
0.795
0.728
0.028
0.047
0.008
Max
5°
–
49/55