MC68HC908JK3 MOTOROLA [Motorola, Inc], MC68HC908JK3 Datasheet - Page 204

• Manufacturer Part Number: MC68HC908JK3
• Description: MC68HC908JK1
• Manufacturer: MOTOROLA [Motorola, Inc]

Mechanical Specifications
19.3 20-Pin PDIP
19.4 20-Pin SOIC
Technical Data
204
SEATING
PLANE
–T–
20
1
20
1
G
20X
18X
0.010 (0.25)
–A–
D
E
G
F
–A–
M
T
A
Figure 19-2. 20-Pin SOIC (Case #751D)
11
10
Figure 19-1. 20-Pin PDIP (Case #738)
–B–
S
D
K
C
B
20 PL
10
11
0.25 (0.010)
S
10X
N
–T–
P
B
Mechanical Specifications
0.010 (0.25)
SEATING
PLANE
K
M
C
T
J
A
F
M
M
B
M
M
J
L
20 PL
0.25 (0.010)
R
X 45
M
M
_
T
B
M
NOTES:
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.150
5. DIMENSION D DOES NOT INCLUDE
MC68H(R)C908JL3
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
(0.006) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
DIM
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
A
B
C
D
G
K
M
P
R
DIM
F
J
G
M
A
B
C
D
E
F
J
K
L
N
12.65
10.05
MILLIMETERS
MIN
1.010
0.240
0.150
0.015
0.050
0.008
0.110
0.020
7.40
2.35
0.35
0.50
0.25
0.10
0.25
MIN
1.27 BSC
0
0.050 BSC
0.100 BSC
0.300 BSC
0
_
INCHES
_
12.95
10.55
MAX
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
7.60
2.65
0.49
0.90
0.32
0.25
0.75
MAX
7
15
_
_
0.499
0.292
0.093
0.014
0.020
0.010
0.004
0.395
0.010
25.66
MIN
MILLIMETERS
MIN
0.050 BSC
6.10
3.81
0.39
1.27
0.21
2.80
0.51
0
INCHES
1.27 BSC
2.54 BSC
7.62 BSC
0
_
_
MOTOROLA
MAX
0.510
0.299
0.104
0.019
0.035
0.012
0.009
0.415
0.029
MAX
27.17
—
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15
7
_
_
Rev. 1.0