C8051F020DK Silicon Laboratories Inc, C8051F020DK Datasheet - Page 166

DEV KIT FOR F020/F021/F022/F023

C8051F020DK

Manufacturer Part Number
C8051F020DK
Description
DEV KIT FOR F020/F021/F022/F023
Manufacturer
Silicon Laboratories Inc
Type
MCUr
Datasheet

Specifications of C8051F020DK

Contents
Evaluation Board, Power Supply, USB Cables, Adapter and Documentation
Processor To Be Evaluated
C8051F02x
Interface Type
USB
Silicon Manufacturer
Silicon Labs
Core Architecture
8051
Silicon Core Number
C8051F020
Silicon Family Name
C8051F02x
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With/related Products
Silicon Laboratories C8051 F020/021/022/023
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1200

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F020DK
Manufacturer:
SiliconL
Quantity:
10
C8051F020/1/2/3
17.1.7. External Memory Interface Pin Assignments
If the External Memory Interface (EMIF) is enabled on the Low ports (Ports 0 through 3), EMIFLE (XBR2.1) should
be set to a logic 1 so that the Crossbar will not assign peripherals to P0.7 (/WR), P0.6 (/RD), and if the External Mem-
ory Interface is in Multiplexed mode, P0.5 (ALE). Figure 17.4 shows an example Crossbar Decode Table with
EMIFLE=1 and the EMIF in Multiplexed mode. Figure 17.5 shows an example Crossbar Decode Table with
EMIFLE=1 and the EMIF in Non-multiplexed mode.
If the External Memory Interface is enabled on the Low ports and an off-chip MOVX operation occurs, the External
Memory Interface will control the output states of the affected Port pins during the execution phase of the MOVX
instruction, regardless of the settings of the Crossbar registers or the Port Data registers. The output configuration of
the Port pins is not affected by the EMIF operation, except that Read operations will explicitly disable the output
drivers on the Data Bus. See
XRAM” on page 145
166
TX0
RX0
SCK
MISO
MOSI
NSS
SDA
SCL
TX1
RX1
CEX0
CEX1
CEX2
CEX3
CEX4
ECI
CP0
CP1
T0
/INT0
T1
/INT1
T2
T2EX
T4
T4EX
/SYSCLK
CNVSTR
PIN I/O 0
    
    
    
    
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    
1
2
3
P0
EMIFLE = 1; EMIF in Multiplexed Mode; P1MDIN = 0xFF)
4
5
for more information about the External Memory Interface.
6
7
Figure 17.4. Priority Crossbar Decode Table
       
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0
AIN1 Inputs/Non-muxed Addr H Muxed Addr H/Non-muxed Addr L
Section “16. EXTERNAL DATA MEMORY INTERFACE AND ON-CHIP
1
  
    
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2
  
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3
P1
4
5
6
7
 
  
   
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0
Rev. 1.4
1
2
3
P2
4
5
6
7
0
Muxed Data/Non-muxed Data
1
2
3
P3
4
5
6
7
Crossbar Register Bits
UART0EN:
UART1EN:
SMB0EN:
PCA0ME:
SYSCKE: XBR1.7
CNVSTE: XBR2.0
SPI0EN:
T2EXE: XBR1.6
T4EXE: XBR2.4
ECI0E: XBR0.6
INT0E: XBR1.2
INT1E: XBR1.4
CP0E: XBR0.7
CP1E: XBR1.0
T0E: XBR1.1
T1E: XBR1.3
T2E: XBR1.5
T4E: XBR2.3
XBR0.2
XBR0.1
XBR0.0
XBR2.2
XBR0.[5:3]

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