DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 188

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
• Repeat area set function
• Acceptance of a transfer request and the start of transfer processing can be notified to an
Rev. 2.00, 03/04, page 154 of 534
This function enables data transfer of ring buffer, etc. efficiently because values in the upper
bits of the transfer address register are fixed and address values in the specific range are
repeated.
Repeat area can be set from one bit (two bytes) to 23 bits (8 Mbytes).
Repeat area can be set for both transfer source and transfer destination.
Interrupt request generation can be set by overflow determination of repeat area.
external device via the DRAK pin.

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