DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 87

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
3.4
Figure 3.1 shows the address map in each operating mode.
Address Map
Note: * These areas can be used as an on-chip RAM area by setting the RAME bit in SYSCR to 1.
H'FFFC00
H'FFFF00
H'FFFF40
H'FFFFFF
H'FF7000
H'FFF000
H'000000
H'040000
ROM: 256 kbytes
RAM: 32 kbytes
Mode 2 (EXPE = 1)
Advanced mode
Extended mode with on-chip ROM
Internal I/O registers
Internal I/O registers
External address
External address
External address
address space*
On-chip ROM
RAM/external
On-chip
space
space
space
Figure 3.1 Address Map
H'FFFC00
H'FFFF00
H'FFFF40
H'FFFFFF
H'FF7000
H'FFF000
H'000000
H'040000
Internal I/O registers
Internal I/O registers
Mode 2 (EXPE = 0)
Advanced mode
Single chip mode
ROM: 256 kbytes
RAM: 32 kbytes
Reserved area
Reserved area
Reserved area
RAM/reserved
On-chip ROM
On-chip
Rev. 2.00, 03/04, page 53 of 534
area*

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