DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 21

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

18.4 Flash Memory Characteristics .......................................................................................... 521
18.5 Use Note (Internal Voltage Step Down) ........................................................................... 522
Appendix
A.
B.
C.
Main Revisions and Additions in this Edition .....................................................527
Index
18.3.3 Bus Timing .......................................................................................................... 504
18.3.4 DMAC Timing..................................................................................................... 515
18.3.5 Timing of On-Chip Peripheral Modules .............................................................. 518
18.4.1 Flash Memory Characteristics ............................................................................. 521
Port States in Each Processing State ................................................................................. 523
Product Lineup.................................................................................................................. 525
Package Dimensions ......................................................................................................... 526
.........................................................................................................523
.........................................................................................................531
Rev. 2.00, 03/04, page xix of xxxii