DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 37

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
1.3
1.3.1
Figure 1.2 shows the pin arrangement.
P57/D7/(
P56/D6/(
P53/D3/(
P52/D2/(
PA1/A17/
Pin Description
Pin Arrangement
PA0/A16/(
P54/D4/
P50/D0/
P55/D5/
P51/D1/
P72/A2/
P71/A1/
P70/A0/
)/
)/
)/
)/
P87/D15
P86/D14
P85/D13
P84/D12
P83/D11
P82/D10
P81/D9
P80/D8
/(
FWE
VCC
VSS
)
)
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
Figure 1.2 Pin Arrangement (TFP-100B)
(Top view)
TFP-100B
Rev. 2.00, 03/04, page 3 of 534
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
P17/USD15
P16/USD14
P15/USD13
P14/USD12
P13/USD11
P12/USD10
P11/USD9
P10/USD8
VCC
HUDITCK
VSS
HUDITDI/RxD0
P27/USD7/
P26/USD6/
P25/USD5/
P24/USD4/
P23/USD3/
P22/USD2/
P21/USD1/
P20/USD0/
P37/USOPM1
P36/USOPM0
P35/(
P34/(
P33/USLSTA1
)/USVBUS
)/USTXV

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