DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 409

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

14.1.1
When each mode pin and the FWE pin are set in the reset state and reset start is performed, this
LSI enters each operating mode as shown in figure 14.2.
• Flash memory can be read in user mode, but cannot be programmed or erased.
• Flash memory can be read, programmed, or erased on the board only in user program mode,
• Flash memory can be read, programmed, or erased by means of the PROM programmer in
user boot mode, and boot mode.
programmer mode.
User mode
Operating Mode
FWE = 0
FWE = 1
Figure 14.2 Mode Transition of Flash Memory
User program
mode
Reset state
On-board programming mode
User boot
Programmer mode setting
mode
Rev. 2.00, 03/04, page 375 of 534
=
0
Boot mode
Programmer
mode