DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 505

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Note: * NMI,
• From any state, a transition to hardware standby mode occurs when
• From any state except hardware standby mode, a transition to the reset state occurs when
is driven low.
: Transition after exception handling
Program execution state
(Internal clock is PLL
circuit output clock)
High-speed mode
Reset state
to
Figure 16.1 Mode Transitions
pin = high
SLEEP
instruction
Any interrupt
External
interrupt
SUSRI
Interrupt
SLEEP
instruction
pin = low
pin = high
: Power- down mode
*
and
Program-halted state
SSBY = 0
SSBY = 1
Rev. 2.00, 03/04, page 471 of 534
standby mode
standby mode
Sleep mode
Hardware
Software
pin = low
is driven low.

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