DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 405

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

This LSI has an on-chip high-speed static RAM. The RAM is connected to the CPU by a 16-bit
data bus and is connected to the DMAC by a 32-bit data bus, enabling one-state access to byte
data, word data, and longword data (note that two-state access is used when the RAM is accessed
by using the longword access instruction such as MOV.L by the CPU).
The on-chip RAM can be enabled or disabled by means of the RAME bit in the system control
register (SYSCR). For details on the system control register (SYSCR), refer to section 3.2.2,
System Control Register (SYSCR).
Product Type
H8S/2170
HD64F2170
ROM Type
Flash memory version
Section 13 RAM
RAM
Capacity
32 kbytes
Rev. 2.00, 03/04, page 371 of 534
RAM Address
H'FF7000 to H'FFEFFF