DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 65

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 2.3
Note: Size refers to the operand size.
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
LDM
STM
B: Byte
W: Word
L: Longword
Data Transfer Instructions
Size*
B/W/L
B
B
W/L
W/L
L
L
Function
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
Cannot be used in this LSI.
Cannot be used in this LSI.
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn
Rn → @-SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @-SP. PUSH.L ERn is identical to MOV.L ERn, @-SP.
@SP+ → Rn (register list)
Pops two or more general registers from the stack.
Rn (register list) → @-SP
Pushes two or more general registers onto the stack.
Rev. 2.00, 03/04, page 31 of 534

Related parts for DF2170BVTE33V