ALXD800EEXJCVD C3 AMD (ADVANCED MICRO DEVICES), ALXD800EEXJCVD C3 Datasheet - Page 226

• Manufacturer Part Number: ALXD800EEXJCVD C3
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ALXD800EEXJCVD C3

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

6.2.2.7
MSR Address
Type
Reset Value
6.2.2.8
MSR Address
Type
Reset Value
226
63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10
63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10
63:54
53:32
31:22
63:54
53:32
31:22
21:0
21:0
Bit
Bit
Row Addresses Bank4 DIMM1, Bank5 DIMM1 (MC_CF_BANKCD)
Row Addresses Bank6 DIMM1, Bank7 DIMM1 (MC_CF_BANKEF)
Name
RSVD
MC_CF_BANKD
RSVD
MC_CF_BANKC
Name
RSVD
MC_CF_BANKF
RSVD
MC_CF_BANKE
RSVD
RSVD
RSVD
RSVD
20000016h
RO
xxxxxxxx_xxxxxxxxh
20000017
RO
xxxxxxxx_xxxxxxxxh
33234H
Description
Reserved. Reads back as 0.
Memory Controller Configuration Bank C. Open row address (31:10) for Bank5,
DIMM1.
Reserved. Reads back as 0.
Memory Controller Configuration Bank B. Open row address (31:10) for Bank4,
DIMM1.
Description
Reserved. Reads back as 0.
Memory Controller Configuration Bank F. Open row address (31:10) for Bank7,
DIMM1.
Reserved. Reads back as 0.
Memory Controller Configuration Bank E. Open row address (31:10) for Bank6,
DIMM1.
MC_CF_BANKCD Bit Descriptions
MC_CF_BANKEF Bit Descriptions
MC_CF_BANKCD Register Map
MC_CF_BANKEF Register Map
GeodeLink™ Memory Controller Register Descriptions
MC_CF_BANKD
MC_CF_BANKC
MC_CF_BANKF
MC_CF_BANKE
AMD Geode™ LX Processors Data Book
9
9
8
8
7
7
6
6
5
5
4
4
3
3
2
2
1
1
0
0