ALXD800EEXJCVD C3 AMD (ADVANCED MICRO DEVICES), ALXD800EEXJCVD C3 Datasheet - Page 623
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ALXD800EEXJCVD C3
Manufacturer Part Number
ALXD800EEXJCVD C3
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet
1.ALXD800EEXJCVD_C3.pdf
(680 pages)
Specifications of ALXD800EEXJCVD C3
Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
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Instruction Set
Note 1.
AMD Geode™ LX Processors Data Book
mod Field
01
01
01
01
01
01
01
01
10
10
10
10
10
10
10
10
11
mod
11
11
11
11
11
11
11
11
d8 refers to 8-bit displacement, d16 refers to 16-bit displacement, and d32 refers to a 32-bit displacement.
Table 8-9. General Registers Selected by mod r/m Fields and w Field
r/m Field
000
001
010
011
100
101
110
111
000
001
010
011
100
101
110
111
xxx
000
001
010
011
100
101
110
111
r/m
Table 8-8. mod r/m Field Encoding (Continued)
DS:[BX+SI+d8]
DS:[BX+DI+d8]
SS:[BP+SI+d8]
SS:[BP+DI+d8]
DS:[SI+d8]
DS:[DI+d8]
SS:[BP+d8]
DS:[BX+d8]
DS:[BX+SI+d16]
DS:[BX+DI+d16]
SS:[BP+SI+d16]
SS:[BP+DI+d16]
DS:[SI+d16]
DS:[DI+d16]
SS:[BP+d16]
DS:[BX+d16]
See Table 8-9.
16-Bit Address Mode with
mod r/m Byte (Note 1)
w = 0
AH
CH
DH
BH
AL
CL
DL
BL
16-Bit Operation
w = 1
AX
CX
SP
BP
DX
BX
SI
DI
DS:[EAX+d8]
DS:[ECX+d8]
DS:[EDX+d8]
DS:[EBX+d8]
s-i-b is present (See Table 8-15 on page 626)
SS:[EBP+d8]
DS:[ESI+d8]
DS:[EDI+d8]
DS:[EAX+d32]
DS:[ECX+d32]
DS:[EDX+d32]
DS:[EBX+d32]
s-i-b is present (See Table 8-15 on page 626)
SS:[EBP+d32]
DS:[ESI+d32]
DS:[EDI+d32]
See Table 8-9
32-Bit Address Mode with mod r/m Byte and
No s-i-b Byte Present
w = 0
AH
CH
DH
BH
CL
DL
BL
AL
33234H
32-Bit Operation
(Note 1)
w = 1
EAX
ECX
EDX
EBX
ESP
EBP
ESI
EDI
623
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