ALXD800EEXJCVD C3 AMD (ADVANCED MICRO DEVICES), ALXD800EEXJCVD C3 Datasheet - Page 613

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ALXD800EEXJCVD C3

Manufacturer Part Number
ALXD800EEXJCVD C3
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet

Specifications of ALXD800EEXJCVD C3

Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
Electrical Specifications
Note 1. All tests, unless otherwise specified, are at V
Note 2. Full-scale transition time is measured from 50% of full-scale transition until output remaining within 1LSB of target.
Note 3. Timing measurements are made with a 75 Ω doubly-terminated load, with VEXT
Note 4. 10% to 90% of full-scale transition.
AMD Geode™ LX Processors Data Book
Symbol
V
I
INL
DNL
t
--
--
t
t
OVAR
FS
RISE
FALL
OS
LX 800@0.9w industrial temperature range part), and C
Parameter
Output Voltage Saturation Limit
Output Current
Integral Linearity Error
Differential Linearity Error
Full Scale Settling Time
DAC-to-DAC matching
Analog Power Supply Rejection
Output Rise Time
Output Fall Time
Table 7-14. CRT Display Analog (DAC) Characteristics
1.25
Min
0.5
0.5
IO
= 3.14V to 3.46V, T
18.67
Typ
45
1
L
= 50 pF.
Max
1.25
1.25
+/-1
+/-1
2.5
4
C
= 0°C to 85°C (or -40°C to 85°C if
Units
LSB
LSB
mA
dB
ns
ns
ns
%
V
REF
33234H
Comments (Note 1)
Achieves 700 mV on 37.5Ω
Note 2
@ 1 KHz
Note 3 and Note 4
Note 3 and Note 4
= 1.235V and R
SET
= 1.2 KΩ.
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