R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 334

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R4F24278NVFQU

Manufacturer Part Number
R4F24278NVFQU
Description
MCU 512K/48K 2.7-5.5V 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet

Specifications of R4F24278NVFQU

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
98
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
R4F24278NVFQU
Manufacturer:
REALTEK
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2 300
Part Number:
R4F24278NVFQU
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 7 Bus Controller (BSC)
(b) Normal space access after DRAM space write access
While the ICIS2 bit is set to 1 in BCR and a normal space read access occurs after DRAM space
write access, idle cycle is inserted in the first read cycle. The number of states of the idle cycle to
be inserted is in accordance with the setting of the IDLC bit. It does not depend on the DRMI bit
in DRACCR. Figure 7.90 shows an example of idle cycle operation when the ICIS2 bit is set to 1.
(8)
Note: The synchronous DRAM interface is not supported by the H8S/2427 Group and H8S/2425
Page 304 of 1448
Idle Cycle in Case of Normal Space Access after Continuous Synchronous DRAM
Space Access:
UCAS, LCAS
Address bus
Group.
HWR, LWR
Data bus
Figure 7.90 Example of Idle Cycle Operation after DRAM Write Access
RAS
RD
φ
(IDLC = 0, ICIS1 = 0, RAST = 0, CAST = 0)
T
p
DRAM space read
T
r
T
c1
T
c2
Idle cycle
T
i
External space read
T
1
T
2
H8S/2427, H8S/2427R, H8S/2425 Group
T
3
DRAM space read
REJ09B0565-0100 Rev. 1.00
T
c1
T
c2
Jul 22, 2010

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