R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 344

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R4F24278NVFQU

Manufacturer Part Number
R4F24278NVFQU
Description
MCU 512K/48K 2.7-5.5V 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet

Specifications of R4F24278NVFQU

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
98
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Section 7 Bus Controller (BSC)
When the BREQ pin is driven high, the BACK pin is driven high at the prescribed timing and the
external bus released state is terminated.
If an external bus release request and external access occur simultaneously, the order of priority is
as follows:
If a refresh request*
as follows:
Notes: 1. Not supported by the H8S/2425 Group.
7.12.2
Table 7.14 shows pin states in the external bus released state.
Table 7.14 Pin States in Bus Released State
Notes: 1. Not supported by the 5-V version.
Page 314 of 1448
Pins
A23 to A0
D15 to D0
CSn (n = 7 to 0)
UCAS*
AS/AH
RD
OE*
HWR, LWR
DACKn (n = 3, 1, 0)
EDACKn*
1
2. Not supported by the 5-V version.
1
2. Not supported by the H8S/2425 Group.
, LCAS*
(High) External bus release > External access by internal bus master (Low)
(High) Refresh*
Pin States in External Bus Released State
2
(n = 3, 2)
1
2
and external bus release request occur simultaneously, the order of priority is
2
> External bus release (Low)
Pin State
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High impedance
High
High
H8S/2427, H8S/2427R, H8S/2425 Group
REJ09B0565-0100 Rev. 1.00
Jul 22, 2010

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