LPC1759FBD80,551 NXP Semiconductors, LPC1759FBD80,551 Datasheet - Page 7

• Manufacturer Part Number: LPC1759FBD80,551
• Description: IC ARM CORTEX MCU 512K 80-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1759FBD80,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 80-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 52
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 6x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC17
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: Ethernet, USB, OTG, CAN
• Maximum Clock Frequency: 120 MHz
• Number Of Programmable I/os: 52
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 6 Channel
• On-chip Dac: 10 bit
• Package: 80LQFP
• Device Core: ARM Cortex M3
• Family Name: LPC17xx
• Maximum Speed: 120 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4968; 935290523551

NXP Semiconductors
1.4 Ordering information
Table 1.
Table 2.
UM10360
User manual
Type number
LPC1769FBD100
LPC1768FBD100
LPC1767FBD100
LPC1766FBD100
LPC1765FBD100
LPC1764FBD100
LPC1763FBD100
LPC1768FET100
LPC1759FBD80
LPC1758FBD80
LPC1756FBD80
LPC1754FBD80
LPC1752FBD80
LPC1751FBD80
Type number
LPC1769FBD100
LPC1768FBD100
LPC1768FET100
LPC1767FBD100
LPC1766FBD100
LPC1765FBD100
LPC1764FBD100
LPC1763FBD100
LPC1759FBD80
LPC1758FBD80
LPC1756FBD80
LPC1754FBD80
LPC1752FBD80
LPC1751FBD80
Ordering information
Ordering options for LPC17xx parts
1.4.1 Part options summary
Package
Name
LQFP100
TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm SOT926-1
LQFP80
Max. CPU
speed
120 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
120 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
64 kB
32 kB
Description
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
plastic low profile quad flat package; 80 leads; body 12 × 12 × 1.4 mm
Flash
512 kB
512 kB
512 kB
512 kB
256 kB
256 kB
128 kB
256 kB
512 kB
512 kB
256 kB
128 kB
All information provided in this document is subject to legal disclaimers.
Total
SRAM
64 kB
64 kB
64 kB
64 kB
64 kB
64 kB
32 kB
64 kB
64 kB
64 kB
32 kB
32 kB
16 kB
8 kB
Rev. 2 — 19 August 2010
Ethernet
yes
yes
yes
yes
yes
no
yes
no
no
yes
no
no
no
no
USB
Device/Host/OTG
Device/Host/OTG
Device/Host/OTG
no
Device/Host/OTG
Device/Host/OTG
Device
no
Device/Host/OTG
Device/Host/OTG
Device/Host/OTG
Device/Host/OTG
Device
Device
Chapter 1: LPC17xx Introductory information
CAN
2
2
2
no
2
2
2
no
2
2
2
1
1
1
yes
yes
yes
yes
yes
no
I
yes
yes
no
yes
yes
yes
no
no
2
S
UM10360
© NXP B.V. 2010. All rights reserved.
DAC
yes
yes
yes
yes
yes
yes
no
yes
yes
yes
yes
yes
no
no
Version
SOT407-1
SOT315-1
Package
100 pin
100 pin
100 pin
100 pin
100 pin
100 pin
100 pin
100 pin
80 pin
80 pin
80 pin
80 pin
80 pin
80 pin
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