MT46H64M16LFBF-6 IT:B Micron Technology Inc, MT46H64M16LFBF-6 IT:B Datasheet - Page 17

• Manufacturer Part Number: MT46H64M16LFBF-6 IT:B
• Description: 64MX16 MOBILE DDR SDRAM PLASTIC IND TEMP GREEN VFBGA 1.8V
• Manufacturer: Micron Technology Inc

Specifications of MT46H64M16LFBF-6 IT:B

• Lead Free Status / RoHS Status: Compliant

Package Dimensions
Figure 8: 60-Ball VFBGA (8mm x 9mm), Package Code: BF
PDF: 09005aef83d9bee4
1gb_ddr_mobile_sdram_t68m.pdf - Rev. E 12/10 EN
Solder ball material:
SAC105 (98.5% Sn,
1% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.4 SMD ball pads.
60X Ø0.45
Seating
plane
7.2 CTR
0.1 A
0.8 TYP
Note:
A
9
1. All dimensions are in millimeters.
8
7
0.8 TYP
6.4 CTR
8 ±0.1
3
2
1
0.65 ±0.05
A
B
C
D
E
F
G
H
J
K
17
9 ±0.1
Ball A1 ID
1Gb: x16, x32 Mobile LPDDR SDRAM
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.0 MAX
Package Dimensions
© 2009 Micron Technology, Inc. All rights reserved.
Ball A1 ID