MT46H64M16LFBF-6 IT:B Micron Technology Inc, MT46H64M16LFBF-6 IT:B Datasheet - Page 20

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MT46H64M16LFBF-6 IT:B

Manufacturer Part Number
MT46H64M16LFBF-6 IT:B
Description
64MX16 MOBILE DDR SDRAM PLASTIC IND TEMP GREEN VFBGA 1.8V
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT46H64M16LFBF-6 IT:B

Lead Free Status / RoHS Status
Compliant
Figure 11: 168-Ball WFBGA (12mm x 12mm), Package Code: MA
PDF: 09005aef83d9bee4
1gb_ddr_mobile_sdram_t68m.pdf - Rev. E 12/10 EN
Solder ball
material: SAC105.
Dimensions apply
to solder balls post-
reflow on Ø0.28
SMD ball pads.
168X Ø0.34
Seating
plane
0.08 A
11 CTR
0.5 TYP
A
23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Note:
1. All dimensions are in millimeters.
12 ±0.1
11 CTR
Ball A1 ID
0.5 TYP
0.38 ±0.05
20
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
12 ±0.1
1Gb: x16, x32 Mobile LPDDR SDRAM
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.23 MIN
0.7 MAX
Ball A1 ID
Package Dimensions
© 2009 Micron Technology, Inc. All rights reserved.

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